AOI Machine (Solder Balling)

Specification

This machine is applied for semiconductor packaging process and mainly used for the quality inspection after ball mounting.

Features

1. High-precision X/Y/Z Positioning ±002mm.

2. Friendly GUI/HMI.

3. Capable of inspecting ball lacking/ bridge/different size.

4. Capable of inspecting tinning ball with special light source.

5. Optional customized GUI/HMI and SECS/GEM function.

6. Capable of integration of loader and unloader for standalone operation.

7. Capable of integration of unloader for Bin operation.