oUR pRODUCTS
Reflow
In line for 2.5D and 3D packaging (after package)
- Dual-track Design
- High UPH (Units Per Hour)
- Efficient Spray System
- Efficient Drying System
- Multiple Safety Protection
- Left to Left ; Right to Right
- Bump Pitch: min.150um / Die Size <60X60mm /Bump Height:65um / Package Size 110X110mm
