oUR pRODUCTS
Fully Automatic Photoresist Removal and Cleaning Machine
Wafer Wet Processing System – Photoresist & Cleaning Line
Wafer Specifications
- Size: 4–12 inches
- Capacity: 25 pcs × 1 or 2 cassettes
Cell Body Configuration (Customizable)
- Photoresist removal cleaning tank × 3
- IPA cleaning tank
- DI pure water tank
Process Control Features
- Chemical loop regulation
- Heating & concentration precision
- Flow rate control
- Ultrasonic cleaning support
- Separated exhaust & discharge for acid / alkali / organic liquids
Chemical Supply Options
- CCSS / LCSS integration
- Automatic mixed acid system
- Optional chemical recovery or discharge
System Configuration
- CO₂ fire extinguishing device
- Antistatic generator
- Integrated camera monitoring
Software Integration
- PC + PLC architecture
- GUI interface
- Protocols supported: SECS GEM / EAP / FDS
