oUR pRODUCTS

Dispenser/Underfill
UV Sealing
Corner Bonding
Encapsulation
Dam & Fill
AB Material Dispense Potting (SMA)
Flux Dispense
Holding (Silicon material)
Motion System:
• XYZ Control by servo motor
• X-Y Move Speed: 800mm/s
• Z Axis Move Speed: 100mm/s
• X-Y Accuracy: ± 0.5mm
• X-Y-Z Resolution: 0.001mm
UV Sealing
Corner Bonding
Encapsulation
Dam & Fill
AB Material Dispense Potting (SMA)
Flux Dispense
Holding (Silicon material)
Motion System:
• XYZ Control by servo motor
• X-Y Move Speed: 800mm/s
• Z Axis Move Speed: 100mm/s
• X-Y Accuracy: ± 0.5mm
• X-Y-Z Resolution: 0.001mm
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