Wafer Etching System Overview

Purpose

Chemical liquid-based wafer etching process with precision control

Wafer Specifications

• Sizes: 4"–12"
• Capacity: 25 pcs × 1 or 2 cassettes

Compatible Chemicals

• HF / BOE / KOH / TMAH / HNO₃ / H₃PO₄...
• Acid / Alkali / Organic liquids
• Controlled chemical flow, heating, cycle & concentration
• Isolated exhaust and discharge systems

Liquid Handling Options

• CCSS / LCSS chemical supply
• Automated mixed acid systems
• Recovery or discharge optional
  

System Configuration

• CO₂ fire extinguishing device
• Antistatic generator
• Integrated camera for monitoring

Software & Integration

• PC + PLC + GUI control system
• Protocol support: SECS/GEM, EAP, FDS 9

Reliability Metrics