AOI Machine (Six Sides)

Specification

This machine is applied for semiconductor packaging process and mainly used for the final products' appearance inspection.

Features

1. High-precision X/Y/Z Positioning ±002mm.

2. Capable of inspecting BGA 120mm x 120mm and as small as >30um.

3. Capable of inspecting the substrate /tinning ball /die /passive component and heat sinker.

4. Special multi-angle light source method for various types of defects.

5. Optional customized GUI/HMI and SECS/GEM function.

6. Capable of integration of software and generate reports.