MEMS Process

• SemiAuto Tape Laminator ( 8” & 12”) 
• Dicing with wafer-ring or wafer dicing
• The vacuum of the ceramic platform is limited to 100pa It can be used for thin wafer mounting and rework
• The stage can be automatically adjusted to various heights and wafer thicknesses
• It can be used with a smelting tool to manually tear off the film