Process Control Features

• Chemical loop regulation
• Heating & concentration precision
• Flow rate control
• Ultrasonic cleaning support
• Separated exhaust & discharge for acid / alkali / organic liquids

Chemical Supply Options

• CCSS / LCSS integration
• Automatic mixed acid system
• Optional chemical recovery or discharge
  

System Configuration

• CO₂ fire extinguishing device
• Antistatic generator
• Integrated camera monitoring
  

Wafer Wet Processing System – Photoresist & Cleaning Line

Wafer Specifications

• Size: 4–12 inches
• Capacity: 25 pcs × 1 or 2 cassettes

Cell Body Configuration (Customizable)

•  Photoresist removal cleaning tank × 3
• IPA cleaning tank
• DI pure water tank
  

Software Control Capabilities

• PC + PLC architecture
• GUI interface
• Protocols supported: SECS GEM / EAP / FDSorts SECS GEM / EAP / FDS protocols

Reliability Metrics